Navid Kazem CEO and Co-Founder of Arieca Inc Lieven Vervecken CEO and Co-Founder of Diabatix Alex Ockfen, P.E. Product Design Engineer at Meta  ____________________________________________________________________________________________________ The SEMI-THERM 40 Symposium was held March 25-28, 2024 at the Double Tree Hotel in San […]

Authors: Jesse Galloway, Reliability and Thermal Engineer Consultant Robin Bornoff, Innovation Roadmap Manager ______________________________________________________________________________________________ Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of electronic packages is controlled, in part, […]

Introduction  In recent years, integrated circuit chips have enabled increasingly powerful computing capabilities as advanced process nodes have moved from DUV (deep ultra-violet) to EUV (extreme ultra-violet) lithography, allowing for higher fabrication resolution and transistor density. Additionally, advanced multi-die packaging […]

OCP Global Summit started this week in San Jose and as to be expected, two topics are getting all the attention –AI Compute and Liquid Cooling. Apart from these two, co-packaged optics (CPO) is another topic that has garnered much […]

Abstract  Data centers face challenges in balancing space and power, with studies showing that when power density exceeds 7kW per rack, IT equipment space utilization drops to 50%. Traditional cooling methods are reaching limits due to increasing demands from deep […]

In the current world of heat transfer analysis, most work is performed with numerical simulation. However, there are ​analysis ​methods​, which​ are faster and useful for early estimates or even design guidance​, that​ are beneficial to thermal engineers.  A recent […]