Introduction  In recent years, integrated circuit chips have enabled increasingly powerful computing capabilities as advanced process nodes have moved from DUV (deep ultra-violet) to EUV (extreme ultra-violet) lithography, allowing for higher fabrication resolution and transistor density. Additionally, advanced multi-die packaging […]

OCP Global Summit started this week in San Jose and as to be expected, two topics are getting all the attention –AI Compute and Liquid Cooling. Apart from these two, co-packaged optics (CPO) is another topic that has garnered much […]

Abstract  Data centers face challenges in balancing space and power, with studies showing that when power density exceeds 7kW per rack, IT equipment space utilization drops to 50%. Traditional cooling methods are reaching limits due to increasing demands from deep […]

In the current world of heat transfer analysis, most work is performed with numerical simulation. However, there are ​analysis ​methods​, which​ are faster and useful for early estimates or even design guidance​, that​ are beneficial to thermal engineers.  A recent […]

Previous articles in this series described how thermocouple wire size [1] and thermocouple attachment method [2] can affect steady state temperature measurements.   This article briefly discusses how these factors can affect the transient response of thermocouples when used to monitor […]

Introduction  This is the first installment in a series of articles that aim to explore a range of practical topics on radiation that will be relevant to those of us focused on electronics cooling and thermal design.   While radiation is […]