ABSTRACT Power densities continue to increase in AI servers, high-performance computing (HPC) systems, electric vehicles, and semiconductor manufacturing equipment.   As a result, thermal management has become a critical system-design requirement.   Thermal solutions often fall short not because one […]

A misconception that experienced thermal engineers have likely encountered is related to the improper use of Theta JA (θJA) of an electronic component. Many electrical and reliability engineers are taught that the junction temperature of an electronic component in any […]

Save your spot now for a brand new virtual event from Thermal Live and Electronics Cooling: Data Center Cooling Day 2026 (DCC ’26), live on July 15. We developed this event to give thermal, mechanical, facility, and data center systems […]

The SEMI-THERM 42 Symposium was held March 9-12, 2026 at the Double Tree Hotel in San Jose, CA. Program organization was led by General Chair Dr. Navid Kazem (Arieca), Program Chair Dr. Claire Wemp (Qnity), and Program Vice Chair Dr. […]

The hidden hardware helping AI’s heat problem If it feels like the semiconductor market is suddenly back in the headlines, that’s because it is. ASML, the world’s leading supplier of photolithography systems, recently reported that its shares have risen around […]

Executive Summary Thermal management is becoming a defining factor in system performance across advanced electronics. Demand is accelerating in AI and high-performance computing, data center infrastructure, electric vehicles, semiconductors, industrial systems, and other high-reliability applications, where increasing power density and […]