Introduction Parametric design plots are commonly used in early thermal architecture studies to understand sensitivity across the design space, often resulting in the selection of a single-point solution that achieves a key design objective. For example, the size of a […]

In April 2025, Google announced its 1 MW 42U rack [1], marking a turning point in data center thermal management where traditional air cooling can no longer support the extreme power densities of modern hardware. As chip thermal design power […]

Introduction The evolution of modern automotive engineering is defined by a single, escalating conflict: the demand for massive computing power versus the shrinking physical space available to house it. As vehicles transition from mechanical machines to “computers on wheels,” the […]

Strategic investment in Emerald AI bridges gap between AI compute demand and grid constraints through IT/OT convergence Fluence Energy Inc. (Fluence) energy storage solutions are designed to accelerate grid connection and enable faster data center deployment PhysicsX collaboration introduces AI-accelerated […]

Signal has announced the introduction of its SHFWT Series Helical Wound Flat Wire Toroidal Inductors, broadening the Signal portfolio with a high-performance solution for demanding electronic designs. The SHFWT Series strengthens Signal’s lineup of chokes, coils, and inductors, responding to […]

JetCool, a Flex company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex’s global mass production capabilities. As AI […]