Signal has announced the introduction of its SHFWT Series Helical Wound Flat Wire Toroidal Inductors, broadening the Signal portfolio with a high-performance solution for demanding electronic designs. The SHFWT Series strengthens Signal’s lineup of chokes, coils, and inductors, responding to […]

JetCool, a Flex company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex’s global mass production capabilities. As AI […]

EDITOR’S NOTE: This article is based on a presentation delivered at Thermal Live Fall 2025 by Mark MacDonald, Thermal Technologist at Ventiva, where he outlined how electrohydrodynamic (EHD) air movers — branded as the Ionic Cooling Engine (ICE) — are redefining thermal system architecture. […]

Johnson Controls, a global technology leader in energy efficiency, decarbonization, thermal management and mission-critical performance, has signed an agreement to acquire Alloy Enterprises, a Boston-based company specializing in a next-generation thermal management platform for high-performance data centers and other mission critical […]

The 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2025) was held from October 28–30, 2025, at the Hotel Fera Anaheim, a DoubleTree by Hilton, in Anaheim, California. Hosted by the ASME Electronic […]

Editorial Note The following transcript is adapted from a presentation delivered by Henkel at Thermal Live Fall 2025. It is shared here to provide readers with access to the technical discussion in written form. For the complete presentation experience, including […]