Thermal interface materials (TIMs) must reduce interfacial thermal resistance while withstanding stresses such as vibration and humidity. Traditional TIMs cannot meet this requirement. Thermal paste, for example, performs well with micron-level surface matching and precise clamping, but is prone to […]

Thermal management has become one of the defining challenges in modern electronics design. Across data centers, AI and machine learning hardware, power electronics, and compact consumer devices, heat generation continues to rise as performance expectations increase. Higher power densities, faster processing speeds, […]

Introduction Parametric design plots are commonly used in early thermal architecture studies to understand sensitivity across the design space, often resulting in the selection of a single-point solution that achieves a key design objective. For example, the size of a […]

In April 2025, Google announced its 1 MW 42U rack [1], marking a turning point in data center thermal management where traditional air cooling can no longer support the extreme power densities of modern hardware. As chip thermal design power […]

Introduction The evolution of modern automotive engineering is defined by a single, escalating conflict: the demand for massive computing power versus the shrinking physical space available to house it. As vehicles transition from mechanical machines to “computers on wheels,” the […]

Strategic investment in Emerald AI bridges gap between AI compute demand and grid constraints through IT/OT convergence Fluence Energy Inc. (Fluence) energy storage solutions are designed to accelerate grid connection and enable faster data center deployment PhysicsX collaboration introduces AI-accelerated […]