FEATURED DIGITAL GUIDES
WHAT’S NEW
Strategic investment in Emerald AI bridges gap between AI compute demand and grid constraints through IT/OT convergence Fluence Energy Inc. (Fluence) energy storage solutions are designed to accelerate grid connection and enable faster data center deployment PhysicsX collaboration introduces AI-accelerated […]
Signal has announced the introduction of its SHFWT Series Helical Wound Flat Wire Toroidal Inductors, broadening the Signal portfolio with a high-performance solution for demanding electronic designs. The SHFWT Series strengthens Signal’s lineup of chokes, coils, and inductors, responding to […]
JetCool, a Flex company and a leading provider of end-to-end liquid cooling solutions for high-density compute, today announced it has collaborated with Broadcom to deliver liquid cooling for next-generation AI XPUs, backed by Flex’s global mass production capabilities. As AI […]
EDITOR’S NOTE: This article is based on a presentation delivered at Thermal Live Fall 2025 by Mark MacDonald, Thermal Technologist at Ventiva, where he outlined how electrohydrodynamic (EHD) air movers — branded as the Ionic Cooling Engine (ICE) — are redefining thermal system architecture. […]
Johnson Controls, a global technology leader in energy efficiency, decarbonization, thermal management and mission-critical performance, has signed an agreement to acquire Alloy Enterprises, a Boston-based company specializing in a next-generation thermal management platform for high-performance data centers and other mission critical […]
The 2025 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2025) was held from October 28–30, 2025, at the Hotel Fera Anaheim, a DoubleTree by Hilton, in Anaheim, California. Hosted by the ASME Electronic […]
FEATURED TECHNOLOGIES


























