Just a quick post to let you know yours truly will be giving a presentation on:
Thermal Design: A Key Part of the Electronics Design Flow
At the UK Solutions Expo at the Heritage Motor Centre in Gaydon on 12th November.
Miniaturization continues to increase power densities at all packaging levels, forcing design teams to identify new methods of cooling. The challenge remains consistent at all levels of electronics packaging – from component packaging to system design – that of efficient removal of waste heat. Ensuring correct thermal calculation and design can result in significantly fewer PCB re-spins offering tangible benefits to the electronic design communities.
If you get the chance to join us in Gaydon don’t miss this session as it contains some fascinating market research from Aberdeen Research that really highlights what a dramatic impact Mentor’s thermal management tools can have on the competitiveness of your business, helping you create more competitive and reliable products and get them to market faster by shortening design times.
If you’re struggling to close the thermal verification at the end of your product design process this session is for you. Come and see how the Mechanical Analysis Division can help you keep your cool when you power up your first new product prototype and help your company ‘Power Up for the Upturn’. It’s FREE to attend and you can even win a FREE notebook!
Hope to see you there.
Dr. J, Hampton Court
