Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
May 11-13, Hyatt Regency, Albuquerque, N.M.
HiTEC 2010 provides a comprehensive technical program addressing the applications, and the latest development in devices, circuits, MEMS, sensors, packaging, power sources, and materials to address the challenges of the applications for high temperature electronics.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
