Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 times the heat dissipation as compared to conventional FR4-based PCBs; a key ability in keeping components cool.