Multiple layers of graphene show strong heat conducting properties that can be harnessed in removing dissipated heat from electron
ic devices, a team of scientists from the University of California reported in a recently published paper in the journal Nature Materials. Having previously shown that graphene — a two-dimensional layer of carbon atoms packed in a honeycomb structure — behaves as a strong heat conductor, the group tested a solution in which multiple sheets of graphene embedded within silicon chips can dramatically improve the thermal characteristics, meaning lower temperatures and a concrete possibility for chip manufacturers to reach higher processing speeds with relative ease.
Read the paper in Nature Materials.
