Yole Developpement has released its new report on Embedded Wafer-Level-Packaging. This analysis covers both Fan-Out WLP technology development and Chip embedding into PCB laminated substrates. These two infrastructures are emerging at the same time and ramping to high volume production.
Key features of the report “Embedded Wafer-Level-Packages: Fan-out WLP / Chip Embedding in Substrate” include:
· Analysis of both fan-out WLP and Chip embedded into PCB substrate technologies
· Key market drivers, benefits and challenges application by application
· Market trends and figures with detailed breakdown by application
· Description of the complete manufacturing tool-box (equipment & materials) for embedded wafer level packaging
· Supply chain perspectives, key players and emerging infrastructure for embedded wafer level packaging
