MH&W International now provides U 90 silicone-free thermal interface materials with a new light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads, and allow their easy positioning between components and heat sinks.
MH&W’s Keratherm U 90 thermal interface material is a ceramic-filled polyurethane film with a thermal conductivity of 6.0 W/mK and thermal impedance of 0.05 Kin2/W. A lower cost version, Keratherm U 80, also silicone-free, provides 1.8 W/mK of thermal conductivity and 0.11 Kin2/W of thermal impedance.
