Pressing needs for new ways to cool electronics for aerospace and defense applications are encouraging the development of new materials to wick heat away from components on boards and in chassis, and also is providing incentive for systems designers to rethink their commitment to commercial off-the-shelf (COTS) technology. One approach to removing heat efficiently from military and aerospace electronics systems is to design them from the beginning with heat removal in mind, one expert says, rather than what has been the engineer’s traditional approach over the last two decades of designing with COTS technology and cooling as best he can.
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