Thermacore’s Therma-Base vapor chamber is used as the base of a heat sink to alleviate spreading resistance found in solid heat sink construction, which enables lower device temperature and greater component reliability.
The chamber features effective thermal conductivity over 5,000 W/mK; application improvement of over 30% in high-flux, poor spreading applications; and over 350 W/cm2 heat flux capability. It can be engineered to withstand increased internal pressure (working temperatures up to 150°C) and various sizes are possible. (Thermacore has experience producing vapor chambers as large as 17″ wide by 30″ long)
The patented Thru-Hole Technology allows both straight and threaded holes through the highly conductive vapor space region for ease in design of attachment hardware. Thermacore vapor chambers have been successfully thermally cycled from -40°C to +85°C.
