Ultra-Thin Waterproof Piezoelectric Speaker
Murata Electronics North America recently launched an ultra-thin waterproof piezoelectric speaker. With a thickness of only 0.9mm, this 19.5mm x 14.1mm speaker enables greater design freedom for the rapidly growing and evolving mobile market. The speaker achieves IPX7 grade waterproof protection without the need of a waterproof acoustic membrane. Using acoustic mesh and double-sided tape to seal the speaker to the front cavity, this waterproof speaker application allows for decreased application costs, thin size, and good sound performance. The high torque nature of the speaker’s piezoelectric motor also makes it ideal for operation in very small and thin back cavities where dynamic speakers struggle to operate. As such, these features make the speaker ideal for mobile phones, music players, digital still cameras, digital video cameras, IC recorders, e-books and other mobile equipment.
Source: Murata
New TIM Catalog Released
Fujipoly has released its new Thermal Interface Material and Elastomeric Connector product catalog. The free 52-page product overview and technical design guide includes installation suggestions, as well as detailed thermal performance and electrical conductivity data points.
Several new pages of high-performance and low-cost thermal materials have been added to complement the company’s current product assortment. Fujipoly’s new expanded catalog also features a complete section dedicated to high density, low resistance, electrically conductive silicone connectors.
Source: Fujipoly
Light Tack Adhesive Eases Fitting of Thermal Interface Pads
MH&W International now provides U 90 silicone-free thermal interface materials with a new light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads, and allow their easy positioning between components and heat sinks.
MH&W’s Keratherm U 90 thermal interface material is a ceramic-filled polyurethane film with a thermal conductivity of 6.0 W/mK and thermal impedance of 0.05 Kin2/W. A lower cost version, Keratherm U 80, also silicone-free, provides 1.8 W/mK of thermal conductivity and 0.11 Kin2/W of thermal impedance.
Source: MH&W
Product Line for Cooling Applications Requiring Fan Guards
Orion Fans now offers a complete line of wire mesh, plastic, louvered, push-on, metal and filtered fan guards and kits, providing design engineers multiple guard options when evaluating fans for their specific applications. Whether the fan application requires finger protection and/or additional filtering to prevent dirt and dust from entering equipment, Orion Fans offers every type of guard option for applications including enclosures, industrial automation, network equipment, medical equipment, truck and automotive.
Get more details from Orion Fans.
Source: Orion
Testing Station Allows Thermal Analysis of Electronics Chassis
Advanced Thermal Solutions, Inc. (ATS) introduces a new testing station that allows in-house, low cost, thermal analysis and testing of electronics chassis and PCBs. The iTHERM-200™ is an integral system of instruments for precisely measuring and recording airflow velocity and temperature data at multiple points inside electronics housings and on circuit cards. The new system includes a freestanding wind tunnel, an automated wind tunnel controller, sensors and a temperature and air velocity scanner. The system’s large test chamber and eight candlestick-style sensors allows characterization testing on active or prototype boards and racks, including single ATCA, MicroTCA, cPCI and AMC.
Source: ATS
New CP3000NV UPS Series (60-160 kVA)
Targeting medium-sized data centers, light industrial systems, and other mid-range power protection applications, Chloride introduces its CP3000NV series of three-phase UPS with module ratings from 60 kVA to 160 kVA.
In line with Chloride’s green commitment, the CP3000NV Series supports environmental objectives by featuring AC-AC operating efficiencies of 95%, a flat load/efficiency curve, lower heat rejection to reduce cooling loads, and Green Battery Management™ technology that minimizes power consumption through intelligent battery charging, resulting in a longer battery life.
To minimize direct electrical and cooling costs, the CP3000NV series is transformer-less at 208/208V and 480/480V, a benefit that also translates into lower overall weight, a smaller footprint, and faster installation. The advanced IGBT front end assures low input harmonics and simple generator interface.
Source: Chloride
Thermal Management Printed Circuit Board for LED Cooling Applications
SinkPAD Corporation is a thermal management company addressing thermal challenges facing the solid state lighting industry specifically in aluminum PCB (LED PCB) applications.
IMS PCBs with efficient through plane thermal conductivities are important for high heat generating LEDs. Although high thermally conductive metals are used, IMS PCB performance is dependent upon the contact area, material thickness and thermal resistance of each material located between heat source and the atmosphere.
SinkPAD™ technology for aluminum IMS PCB significantly improves LED thermal management in all LED systems but is most effective in high-power and high-bright surface mount LED systems that can’t efficiently dissipate heat rendering them unviable for commercialization.
SinkPAD™ conducts heat out of the LED system (LED cooling) by enabling a direct thermal path between the LED and surrounding atmosphere, which eliminates thermal resistance introduced by the dielectric material in a traditional IMS PCB or MCPCB. The SinkPAD™ design completely removes the substance with the lowest thermal conductivity/highest thermal resistance from the structure. SinkPAD™ still uses a dielectric, but this dielectric isolates the metal base electrically and leaves it thermally connected.
Source: SinkPAD
Silicone Elastomer Handbook Released
The Silicone Elastometer Handbook, A guide to applied silicone elastometer technology, explores all up-to-date aspects of silicone technology and offers case histories to reinforce principles being relayed and display real-world problem solving. Written by David M. Brassard, founder and technical director of Silicone Solutions, the book is based on a short course the author teaches at the University of Akron, College of Polymer Science and Polymer Engineering. The handbook can help companies explore the possibilities of entering the silicone market, including, but not limited to formulations, raw materials, current suppliers, as well as necessary equipment.
Source: Silicone Solutions
Thermal Gap Fillers Combine High Performance, Low Pricing
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer. Applications for these gap fillers include alternative energy, consumer electronics, telecommunications, power supplies, flat panel displays, and portable electronics.
Source: MH&W International
