The High Density Packaging (HDP) User Group recently launched its second edition of Board Mounted Power Supply (BMPS) Application Guidelines. First, launched in March 2007, it was designed to support the communications and electronics manufacturing industry by promoting better understanding of BMPS products. Since then major users and manufacturers of BMPS products, have continued working to define the market’s requirements and understandings with respect to these products. The new edition has significant improvements in areas such as Cooling, Digital Power, Energy Efficiency, High Voltage Distribution, Lead-free Soldering, Point-of-Load, Remote Powering, and Total Cost of Ownership.
Contributors to the updated document include Agilent, Cisco, Alcatel-Lucent, Emerson, Ericsson, Flextronics, Infineon, International Rectifier, IPC, Linage Power, Murata Power Solutions, Netpower Labs, NetPower Technologies, Powerbrand Consulting, TDK-Lambda, Texas Instruments, Vicor Corporation. The document is endorsed by users and systems integrators including Alcatel-Lucent, Ericsson, Huawei, Juniper Networks, Nokia Siemens Networks, and supported by the Power Sources Manufacturers Association (PSMA) and the European Power Supply Manufacturers Association (EPSMA).
The BMPS Application Guidelines document is available on the HDP User Group website.
