Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated turn-off thyristors (SGCTs), and silicon controlled rectifiers (SCRs). Power electronic devices dissipate large amounts of heat relative to their package footprints, which requires a heat sink significantly larger than the device for electronics thermal management. This results in large conduction-induced temperature gradients within the heat sink, according to ACT.
Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling
