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Electronics Cooling

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Heat Pipe-Assisted Heat Sinks for Power Electronics Cooling

Applications, Articles, Heat Pipes, Heat Sinks, New Products , , ,

Advanced Cooling Technologies Inc. (ACT) in Lancaster, Pa., is introducing the heat-pipe-assisted HiK Plate heat sinks for power electronics cooling applications involving insulated gate bipolar transistors (IGBTs), thyristers, intelligent power modules (IPMs), symmetric gate commutated turn-off thyristors (SGCTs), and silicon controlled rectifiers (SCRs). Power electronic devices dissipate large amounts of heat relative to their package footprints, which requires a heat sink significantly larger than the device for electronics thermal management. This results in large conduction-induced temperature gradients within the heat sink, according to ACT.

For more product information, visit ACT.

About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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