Nextreme Thermal Solutions recently introduced the eTEC HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements. At 85°C, the eTEC 0.6mm-high HV56 can pump 6 watts or 58 W/cm2 of heat in footprint of only 11 mm2. At 85°C, the eTEC HV56 can create a temperature differential (∆T) of up to 60°C between its hot and cold sides, and operates at a maximum voltage of 10.8V, making it compatible with commonly found board-level currents and voltages. At 25°C, the device can create a ∆T of up to 50°C with a maximum voltage of 8.8V.
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TECs for Larger Heat Pumping Applications
