In this paper from Texas Instruments, the authors present a novel power package design that enables heat conduction to the top surface of the microelectronic package through the use of a high thermal conductivity path which reduces by more than a factor of ten the junction-to-top thermal resistance compared to standard solutions. The paper discusses the design, manufacturability, performance and reliability of the package as well as thermal measurements which demonstrates the ability of the package to dissipate the heat.
Novel Thermally Enhanced Power Package
