Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. This two component adhesive, sealant, and coating has a convenient 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of >400 volts/mil and a tensile shear strength greater than 1,000 psi.
Thermally Conductive Epoxy
