Sponsor

Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

Sponsor

Thermally Conductive Epoxy

Materials, Compounds, Adhesives, Substrates, New Products

Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. This two component adhesive, sealant, and coating has a convenient 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures.  EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of >400 volts/mil and a tensile shear strength greater than 1,000 psi.

Read more from Master Bond.

About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

Industry Sponsors

Sponsor
Sponsor