Fujipoly’s new Sarcon® SG-26SL silicone-based thermal grease delivers a thermal conductivity of 2.6 W/m°K while exhibiting minimal bleed and evaporation characteristics. The non-flowing consistency of Sarcon® SG-26SL makes the grease ideal for power converter and high-performance CPU applications that have bond lines as small as 1 mil.
The compound is easy to apply as well as remove during assembly and rework processes and delivers consistent performance over temperatures that range from -67°F to 401°F.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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