Nordson MARCH’s new FlexTRAK™-WF plasma treatment system is a cassette-based automated plasma treatment system that handles five wafer sizes with minimal hardware change-over. An integrated robot and aligner automate the processing of a wide variety of wafers and other flat substrates. The system offers high throughput, ranging up to 50 wafers per hour, while maintaining superior plasma uniformity for ashing, etching, and descum for wafer level packaging and general wafer-based processing applications.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.





