Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Don’t miss out on the September 2011 issue of ElectronicsCooling, which includes feature articles on thin film thermoelectrics, strategies for using thermal calculation methods and real-time data center cooling analysis, as well as technical briefs.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
