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25th European Workshop on Thermal and ECLS Software

Industry Updates

Nov. 8-9, Noordwijk, The Netherlands

The 25th annual European Workshop on Thermal and ECLS Software, organised by the Analysis and Verification Section of the Thermal Division, ESTEC, will be held on:

Tuesday 8th and Wednesday 9th November 2011
at ESTEC, Noordwijk, the Netherlands.

The goals of the Workshop are:

  1. to promote the exchange of views and experiences amongst the users of European thermal/ECLS engineering analysis tools and related methodologies
  2. to provide a forum for contact between end users and software developers
  3. to present developments on thermal/ECLS engineering analysis tools and to solicit feedbac

to present new methodologies, standardisation activities, etc.

Learn more.

About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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