Northrop Grumman Corporation has received a patent for a new design to improve the cooling efficiency of a removable electronic module through enhancements to its physical design, and has begun to license it to other companies.
The company received U.S. Patent Number 7,995,346 for the “ruggedized, self-aligning, sliding air seal for removable electronic units.” The invention improves the air cooling of advanced electronic modules that incorporate an air-flow-through, compact core style heat exchanger design.
