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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Carbon-Based Passive Thermal Management Material

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Applied Nanotech’s new passive thermal management material, CarbAl™, is a carbon-based material with a unique combination of low density, high thermal diffusivity, and low coefficient of thermal expansion.

CarbAl™ has a density of 1.75 g/cm3 compared to 2.7 g/cm3 for aluminum and 8.9 g/cm3 for copper. While copper has a slightly higher thermal conductivity than CarbAl™, 390 W/mK compared to 350 W/mK, CarbAl’s thermal diffusivity is approximately 2.9 cm2/sec compared to 0.84 cm2/sec for aluminum and 1.12 cm2/sec for copper.

Learn more from Applied Nanotech.

About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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