Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Conference chair speaks about “The Heat is On,” a mini-conference of SEMI-THERM 28, which deals in the thermal management and packaging of electronic products and devices. The theme was evolutionary and revolutionary trends in the field.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
