Fujipoly will be at SEMI-THERM showcasing its Sarcon® 50G-Hm high performance, low resistance gap filler pad, Sarcon® GR-SL low compression thermal gap filler material, and Sarcon® SG-26SL silicone-based thermal grease.
The Sarcon® 50G-Hm is manufactured with a special low-tac top surface. The one-sided treatment is less sticky than the opposing surface allowing the thermal pad to adhere to either the target electrical component or opposing heat sink.
The Sarcon® GR-SL quickly conforms to all gaps, peeks and air pockets making a level, large surface area contact point. The high degree of physical contact allows the heatsink to more efficiently remove unwanted heat.
The Sarcon® SG-26SL makes the grease ideal for power converter and high-performance CPU applications that have bond lines as small as 1 mil. The material’s low thermal resistance provides for efficient transfer of unwanted heat from board-level components to nearby heat sinks.
