AOS Thermal Compounds showcased its thermally conductive interface material, thermal grease and gap filler at SEMI-THERM 28 in San Jose, California.
The company’s Micro-Faze®A is a dry-to-touch thermal interface pad formulated with non-silicone thermal grease. It was developed by AOS to offer the low thermal resistance in a thermal interface without the mess of grease. Micro-Faze A is a die-cut aluminum foil substrate coated on both sides with specially formulated thermal grease that is naturally tacky but dry to the touch.
AOS 52137 MF Thermal Grease is a non-silicone based thermal grease that goes beyond the original AOS 52022, Wakefield 126, Aavid Sil-free, GC Type 44 and Tech Spray 1978 in terms of thermal resistance. The 52137 exhibits a very thin bond line, has higher thermal conductivity, and can be removed with either water or typical paint thinner.
AOS Sure-Form® Gap Filler 52153 is a one part, silicone, synthetic-based thermal grease that is more than three times as conductive as the 52022. This dark gray product is very tacky, resists vibration and shock, will stay in place and not run, even under elevated use temperatures. The product is very viscous with a high initial yield point, will flow under higher shear and tends to increase in viscosity slightly over time.
