A North Carolina State University researcher has developed a technique that uses a “heat spreader” made of a copper-graphene composite, which is attached to the electronic device using an indium-graphene interface film, both of which have higher thermal conductivity, allowing the device to cool efficiently. Dr. Jag Kasichainula, an associate professor of materials science and engineering at NC State, found that the copper-graphene film’s thermal conductivity allows it to cool approximately 25 percent faster than pure copper, which is what most devices currently use.
Dissipating heat from electronic devices is important, because the devices become unreliable when they become too hot.
