Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
July 8-12, Puerto Rico
This conference will bring together international researchers and engineers focusing on heat and mass transfer and fluid flow in a variety of applications. The objectives of the meeting are to provide a forum for presentation of state-of-the-art research and opportunities for technical interactions among participants.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
