Cooler Master has announced the broader adoption of Vapor Chamber Technology developed by Cooler Master’s OEM and industrial cooling division in its retail Heatsinks. Cooler Master is expanding the TPC series and will equip selected Models of the V series with Horizontal Vapor Chambers.
Horizontal Vapor Chambers spread heat eight times faster than solid copper, eliminating hot spots and spreading heat evenly across the base of a heatsink. Horizontal Vapor Chambers allow faster and more efficient transfer of heat from the CPU to the heatpipes and fins, which results in lower temperatures and slower, quieter fans.
For more information visit Cooler Master’s website.
To read a review of the vapor chambers visit Benchmark Reviews.
