Future Facilities, a provider of data center design and operational management software, has partnered with Intel to integrate a 3-D data center model known as Virtual Facility with the new thermal sensors Intel is embedding into its servers. By embedding the new thermal sensors, Intel will be able to allow the CPU to optimize IT load capacity planning and eliminate the need for additional external sensors to regulate system cooling and airflow.
Accommodating the fluctuations in temperatures caused by IT power densities and airflow requirements is one of the biggest challenges for cooling systems. According to Future Facilities CEO, Hassan Moezzi, up to half of the total power consumption dedicated to cooling in a data center is wasted. The new Virtual Facility technology, combined with embedded thermal sensors, will allow data center managers to predict and alleviate problems before physical changes are implemented in the system, thus reducing the energy demand for cooling.
The integration of the virtual facility is expected to open a new area of development in the field of information technology.
