Sp3 Diamond Technologies, Inc., a developer of CVD hot filament diamond deposition reactors and diamond-based solutions for electronics thermal management, has been awarded two patents by the United States Patent and Trademark Office for its DiaMatch™ coefficient of thermal expansion (CTE) matched heat spreader technology. DiaMatch™ is a diamond-based multilayered structure that delivers heat spreading and CTE matching for semiconductor and laser packaging. U.S. Patent No. 8,105,693 covers a multilayered structure that includes at least one diamond layer while U.S. Patent No. 8,147,927 covers the methods of making these multilayered structures.
According to Dwain Aidala, president and COO of sp3 Diamond Technologies, the company received Phase II SBIR funding from the Missile Defense Agency (MDA) to develop a thermal management solution for future development of high power lasers and semiconductors and are currently in the process of identifying the right thermal management or specialized material partners to further develop the technology.
