In response to the serious deficiencies of traditional thermal materials, new advanced materials are 
continually being developed, a number of which have thermal conductivities up to 1700 W/m-K with low densities and low coefficients of thermal expansion (CTEs):
- What are the payoffs?
- Do the advantages outweigh the disadvantages?
- How are these new advanced materials currently applied?
- What are the future directions?
- How can they meet thermal, weight, and size requirements in a cost-effective way?
- In what ways do they allow you to maintain a competitive edge?
This webinar is ideal for any engineers, scientist, or manager involved in microelectronic, optoelectronic and MEMS/MOEMS thermal management, packaging design, production and R&D, and material suppliers.
Speaker: Carl Zweben
For the full abstract and more information on the speaker, click here.
