Aremco Products, Inc., a developer of technical ceramics, adhesives, coatings and sealants, has released Aremco-Bond™ 860, a thermally conductive epoxy system developed for bonding heat sinks and fins used in heat exchangers and electronic assemblies.
Aremco-Bond™ 860 is comprised of a ratio of one-part base resin to one-part activator by weight and can be used for applications with temperatures up to 400°F (204°C). The epoxy exhibits a thermal conductivity of 8.5 Btu-in/hr-ft2-°F, a dielectric strength of 250 volts/mil and tensile shear strength of 1,375 psi. Aremco-Bond™ 860 cures in 24 hours at room temperature or 2 hours at 200°F.
