Electronic components provider Bergquist Company has released Liqui-Form 2000, a liquid formable material with high thermal conductivity designed for applications requiring low component stresses during assembly and ease of rework. Liqui-Form 2000 requires no curing, mixing or refrigeration and has a low volumetric expansion, stable viscosity and natural tack.
According to Bergquist Company, Liqui-Form 2000 is ideal for devices requiring low assembly pressure, bare die to heat spreader lid and filling various gaps between heat-generating devices and heat sinks or housings.
