Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
December 23-25, 2012
Phuket, Thailand
The 33rd International Conference on Fluid Mechanics, Heat Transfer and Thermodynamics aims to bring together academic scientists, engineers, industry researchers and students to exchange personal experiences and research results and discuss practical challenges encountered in the field.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
