Epoxies, Etc., a manufacturer of thermal management compounds, epoxies and adhesives, has released a new silicone potting and encapsulating compound. According to the company, the 50-1952 is formulated for rapid thermal transfer away from heat-generating electronic devices.
The new silicone compound is made of flexible material to protect electronics from vibration and impact and is solvent-free. 50-1952 exhibits an operating temperature range of -65 to 235°C (-85°F to 455°F) and a 1:1 mix ratio.
