Nextreme Thermal Solutions, developer of micro-scale thermal management and power generation solutions, has released a new series of thin-film thermoelectric modules (TEM) for low-profile thermal management in medium heat flux applications. According to the company, the new TEMs offer “higher cooling capacity, robust mechanical design and source-matched heat flux density for easier integration into existing electronic systems” and are designed for use in the photonics, test and measurement, electronics and aerospace industries.
The new eTEC MA8000 series modules measure 1.1mm thick and can pump from 10 to more than 80 watts of heat at an ambient temperature of 25°C with footprints ranging from 63 to 375 mm². The new series features heat flux densities ranging from W/cm² to 22 W/cm², giving the “ability to match thermoelectric cooling designs more [efficiently] to heat sources and existing convection-based heat rejection systems,” according to the company.
