Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
January 31, 2013
San Jose, Calif.
Future Facilities invites all electronics thermal engineers and designers to test themselves in a design challenge using the company’s 6SigmaET thermal simulation software. The winner of the challenge will receive an iPad.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
