The U.S. Defense Advanced Research Projects Agency (DARPA) has released a formal request to industry for assistance in the development of new electronics cooling techniques for use in military embedded systems and radio frequency monolithic microwave integrated circuit (MMIC) power amplifiers. The request comes as part of the Intrachip/Interchip Enhanced Cooling (ICECool) Applications program, which was created to investigate the development of new thermal technologies capable of reducing the thermal limitations of military electronics.
The announcement refers specifically to the first phase of the ICECool program, which will examine the possibility of reducing the size, weight and power consumption of cooling subsystems. According to DARPA officials, the ability to cool electronic chips is progressing too slowly, placing a size limitation on the chips.
For more information, visit Military & Aerospace Electronics.
