Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
March 5-6, 2013
Dubai, United Arab Emirates
The 34th International Conference on Heat Transfer and Applications will bring together academic scientists, researchers and students for the exchange of personal experiences, research results, theories and practical applications pertaining to all aspects of heat transfer and applications.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
