Researchers from the University of Cambridge, U.K. and CIC nanoGUNE in Spain have developed a new cooling technology for the thermal management of computer chips and other miniaturized devices that utilizes materials that change their temperature when exposed to magnetic fields. Materials measuring only 20 nm tick and comprised of comprised of lanthanum, calcium, manganese and oxygen were developed by researchers for the experiment.
According to Dr. Luis Hueso of CIC nanoGUNE, the new technique creates an effect “similar to that of a magnetic field” by “straining the material and then relaxing it…thus inducing the magnetocaloric effect responsible for cooling.”
By straining the material to create an effect similar to a magnetic field, researchers were able to avoid the negative side effects often associated with combining chips and magnetic fields while creating “a more local and more controlled cooling method…in line with the trend in the miniaturization of technological devices,” Hueso said.
In addition to use in microelectronic components, the research team hopes that the new cooling technology will also be advantageous for reducing the environmental impact of cooling large data centers.
