Infineon Technologies AG and Henkel Electronic Materials have collaborated to release a new type of heat-conducting paste “optimized” for thermal management of power semiconductors. According to the two companies, the new compound allows a higher power density for the same ageing resistance.
According to Dr. Martin Schulz of Infineon Technologies AG, “[LOCTITE TCP 7000] simplifies the link between the module and the heat sink [and] optimizes heat transfer, [extending] both the service life and the reliability of the modules.”
Testing completed on Infineon Technologies’ D series EconoPACK+ module revealed that the contact resistance between the module and the heat sink dropped by 20 percent when the new compound was applied. LOCTITE TCP 7000 is RoHS-compliant, silicone-free and does not conduct electricity.
“The development of LOCTITE TCP 7000 is a major step forward for high-power, high-temperature thermal management,” Jason Brandi, market development manager for Henkel Electronic Materials, said. “A printable, phase-change TIM with such robust thermal cycling performance is indeed a breakthrough, overcoming the limitations of alternative materials and pioneering a brand new solution for power muddle thermal management.”
