April 15-17, 2013
Wroclaw, Poland
Hosted by the Wroclaw University of Technology in Poland, the 2013 IEEE International Conference on thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems aims to promote further development and application of simulation methodologies and tools for the electronics industry, improve communication between developers and industry users and strengthen cooperation between industry, universities and research institutes. Attendees will have the opportunity to attend technical programming and training courses, as well as a product and services exhibition.
