Fujipoly introduces its SARCON SPG-20A, a low-viscosity thermally conductive silicone compound.
When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material fills gaps up to .50 mm in height.
According to the company, “The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C). In addition, SARCON® SPG-20A provides a thermal conductivity of 2.0 W/m°K with a thermal resistance of only 2.1°C cm2/W.”
