This year, SEMI-THERM has introduced the Executive Briefing: Thermal Management Market Visions & Strategies conference in conjunction with the SEMI-THERM annual symposium. Aimed at bringing technology and technical leaders, C-Level executives and engineering, product development and business managers together, the executive briefing program will focus on current market issues, new technology and advancements in industry.
A number of speakers will present during the Executive Briefing, including keynote speaker Roger Stout, P.E. of ON Semiconductor, who will discuss the need for better thermal education in the electronics industry. Other speakers include:
- Bill Bottoms of 3MTS , who will discuss future thermal management requirements of 3D-system-in-package (SiP) products;
- Pat Bournes of Phillips Lumileds, who will cover the growth of LEDs;
- Kevin Closson of Nerac, Inc., who will discuss the current state of research and development activity in thermal management;
- David Copeland of Oracle Corp., who will cover data center and server thermal trends and challenges;
- Reza Ghaffarian of the California Institute of Technology; who will cover thermal challenges of complex FPGA/3D ICs for Space Applications;
- Kevin Goodson of Stanford University, who will discuss how to best make use of Department of Defense funding for thermal management;
- Radesh Jewram of the Berquist Co., who will discuss emerging trends for thermally conductive materials in electronics packaging;
- Patrick Loney of Northrop Grummman, who will discuss increasing performance from a legacy system;
- Ilyas Mohammad of Invensas, who will discuss thermal management challenges in mobile integrated systems;
- Dave Redford of Global Engineering Support AT&T NPE, who will discuss developing communications networks; and
- Sam Zhao of Braodcom Corp., who will cover mobile phone thermal design analysis.
