Experts at Indium Corporation’s will present a workshop on Composite Solder Preforms for High Temperature Pb-free Die Attach Wednesday, March 20, 2013 at SEMI-THERM.
Jordan Ross, senior product manager of engineered solders and thermal materials, and Weiping Liu, research metallurgist, will discuss high temperature Pb-free solder materials needed in die-attach, flip-chip packaging, power semiconductor, and optical device packaging.
According to Indium, Ross and Liu will discuss a special laminate composite preform “specifically developed for high-temperature Pb-free solder applications, where a melting temperature of 280°C or higher is required.”
