May 22, 2013
Online
Presented by Steve Carlson, a Mechanical Engineer Analyst at Northrop Grumman Navigation
Systems Division in Woodland Hills, Calif., this webinar will focus on three topics:
- how variations in coefficients of thermal expansion (CTE) can affect the magnitude of the displacements, forces, and stresses that are developed in electronic assemblies during thermal cycling environments and how these factors affect fatigue life;
- how resonant conditions can affect dynamic displacements, forces and stresses in electronic assemblies during different sine and random vibration environments; and
- the concept of “damage accumulation” and how it can be used to determine the approximate fatigue life of various electronic assemblies due to different combinations of fatigue accumulated in thermal cycling and vibration environments.
