Thermal Engineering Associates, Inc. (TEA) has announced the availability of a new family of thermal interface material characterization tools.
According to TEA, the new tools are designed to make the testing and evaluation of TIM materials simpler and more cost-efficient, and are comprised of the company’s thermal test chip—available in sizes ranging from 2.5mm square to 12.8mm square—mounted on a variety of packages, including ball grid array (BGA), quad-flat no-leads (QFN) and dual in-line (DIP).
TEA’s TTV-1100/1200 series thermal test chips are mounted on a 27 x 27mm BGA package with 1mm pitch and 0.6mm diameter balls, while the TTV-1800 is mounted on an 18 mm BGA package with 0.5mm pitch and 0.3mm diameter balls. Thermal test chip sizes for the TTV-1100/1200 series range from 2.5mm square to 12.8mm square, while the TTV-1800 chip measures 12.8mm square. The TTV-1500 series is mounted on a BGA package measuring 12.8mm squarewith 0.8mm pitch and 0.6mm diameter balls. The TTV-1500 series features a 5mm square thermal test chip mounted in either flip chip or wire bond configuration.
The TTV-3000 series of thermal test chips encompasses a range of chip sizes from 2.5mm square to 7.65mm square “mounted in open-cavity, direct-attach pad direct-attach pad QFN packages ranging in size from 6mm square to 12mm square.” The TTV-3100 series features 2.5mm square and 5mm square thermal test chips “mounted on 24-pin, ceramic side-braze DIPs with removable lids.”
For more information, visit Thermal Engineering Associates.
