Researchers at Advanced Cooling Technologies Inc. have developed a new cooling technique for high-power VPX embedded computing cards that utilizes embedded heat pipes to increase heat removal for computer boards. The new Dual-Sided Condenser technology is ideal for military embedded computing applications, including radar signal processing, avionics electronics boxes and RF and microwave systems.
According to Bryan Muzyka, a sales engineer at ACT, “a typical conduction-cooled VPX module moves about 70 percent of its heat away from components on the board through the metal card frame and about 30 percent of its heat through the card wedge lock.” ACT’s new Dual-Sided Condenser technology, however, balances heat dissipation “to 50 percent from the card frame and 50 percent from the wedge lock.”
The new technology does not increase the side of the card frame and only slightly increases the weight of the device, Bryan added.
For more information, visit Advanced Cooling Technologies.
