Penn Engineering has released the new patent-pending PEM heat sink mounting system for secure attachment of heat sinks to circuit boards.
According to the company, the new heat sink mounting system consists of “Type HSCB captivating screw and Type HSL spring mated to Type HSR™ broaching receptacle nut or standoff. . . . Screws can be installed into aluminum or steel sheets as thin as 1mm and nuts/standoffs can be broached into boards as thin as 1.53mm.”
The new mounting system also “integrates a unique audible ‘click’ feature to prevent over tightening during installation, accommodates slight expansion and contraction of joint components without causing stress or damage to delicate and expensive circuitry, and allows for removal of the heat sink if necessary.”
