Japanese electronics maker Nippon Electronics Corporation (NEC) may have taken a step towards raising the current limit on smartphone processing capabilities with the company’s unveiling of the world’s first liquid-cooled smartphone earlier this month.
While more effective cooling methods continue to be developed to combat larger heat loads in high-end computers, current smartphone cooling technology continues to limit the processing power of many smartphones.
Launched as part of NTT DOCOMO’s 2013 summer product line in Japan, the Medias X N-06E smartphone contains a Qualcomm Snapdragon 600 processor that utilizes a liquid coolant-filled heat pipe to funnel heat away from the processor. According to NEC, the heat pipe, combined with a graphite sheet that runs parallel to the phone’s motherboard, helps to manage and dissipate the heat generated.
The phone runs Android 4.2 and also features a waterproof and dustproof casing, 4.7-inch 720p OLED display and 13.1-megapixel camera.
